Semiconductor Plating DSA is a highly efficient and reliable plating system designed for the semiconductor industry.
It provides precise control and invariant plating of colorful accoutrements onto semiconductor substrates, icing high- performance and high- quality products.
It utilizes advanced technology and chemistry to deposit thin layers of essence or other accoutrements onto semiconductor substrates. It's grounded on the principle of electroplating, where an electric current is passed through a result containing the asked material, performing in a deposit of the material onto the substrate. The system consists of colorful factors, including a plating bath, power force, and controlunit.It provides precise control and invariant plating of colorful accoutrements onto semiconductor substrates, icing high- performance and high- quality products.
It offers cutting-edge digital switching technology for demanding semiconductor manufacturing applications that require ultra-precise process control and nanometer-scale tolerances.
The core DSA (Digital Switching Amplifier) enables real-time current tuning needed for super-uniform plating deposition. Advanced anode activation methods accelerate plating speeds. Robust hardware components stand up to rigorous 24/7 production environments.
Intuitive touchscreen interface allows easy monitoring and adjustment of plating parameters. The modular and reconfigurable system can scale up to meet increased production capacity needs.
With thousands of worldwide installations, our Semiconductor Plating solutions have a proven track record satisfying the stringent requirements of leading chipmakers. We have extensive experience tailoring our plating technology for wafer bumping, redistribution layer fabrication, TSV metallization, and other advanced IC packaging and interconnect processes.
Plating bath: A container filled with the plating solution.
Power supply: Provides the necessary electric current for the plating process.
Control unit: Regulates the plating parameters, such as voltage and current, to ensure precise and uniform deposition.
Electrodes: The anode and cathode used for the plating process.
Chemicals: Various chemicals are used in the plating bath to control the plating process.
Parameter | Value |
---|---|
Plating Rate | Up to 10 microns per minute |
Plating Uniformity | Within 2% variation across the substrate |
Plating Thickness Control | Accurate within 0.1 microns |
Deposition Quality | High-density and void-free |
Parameter | Value |
---|---|
Dimensions | 1500mm x 1000mm x 2000mm |
Weight | 500kg |
Power Consumption | 10kW |
Voltage | 220V |
Semiconductor Plating DSA offers cost-effective solutions for the semiconductor industry. The plating system reduces material waste and ensures high yield, leading to significant cost savings.
Precise and uniform plating
High plating rate
Accurate thickness control
High-quality deposition
Cost-effective
Reliable and efficient
It is widely used in the semiconductor industry for various applications, including:
(1)Integrated Circuits (ICs) Production
The Semiconductor Plating system enables high-precision copper electroplating for on-chip interconnects and redistribution layers in IC fabrication. Its stable current delivery and temperature controls deposit uniform copper layers with excellent conductivity meeting the demands of advanced ICs.
(2)Semiconductor Device Packaging
The system allows targeted plating of copper pillars, bumps and through-silicon vias (TSVs) during wafer-level, chip-scale and 3D packaging processes. Tight process controls prevent voids and enable reliable flip-chip assemblies.
(3)Wafer Fabrication
The Semiconductor Plating system is ideal for copper seed layer deposition, copper pillar bump plating, and TSV metallization during silicon wafer fabrication. It can also be used for plating solder bumps and tin-silver finish layers with excellent uniformity.
(4)Thin-Film Deposition
With its precise current delivery and solution agitation, the system deposits uniform thin-films of copper, gold, silver, tin and other metals for wafer-level redistribute layers, interconnects, and device structures with nanometer-scale tolerances.
1. Can I use Semiconductor Plating for plating non-semiconductor materials?
No, it is specifically designed for semiconductor plating applications and may not be suitable for other materials.
If you are considering Semiconductor Plating DSA for your requirements, please feel free to contact us at yangbo@tjanode.com. We are a professional manufacturer and supplier, offering strong technical expertise, comprehensive after-sales service, and fast delivery.
YOU MAY LIKE
Product name: Copper Foil Anode<br>Product Overview: It is an electrolysis equipment used in the production process of copper foil. Its main function is to perform an electrolysis reaction on the titanium anode plate and reduce copper ions into the copper foil.<br>Product advantages: excellent electrochemical performance, corrosion resistance, precision processing, reasonable structure, safety, and reliability.<br>Technical advantages:<br>Long life: ≥40000kAh m-2 (or 8 months)<br>High uniformity: coating thickness deviation ±0.25μm<br>High conductivity: oxygen evolution potential ≤1.365V vs. Ag/AgCl, working condition cell voltage ≤4.6V<br>Low cost: Multi-layer composite electrode preparation technology reduces cell voltage by 15% and cost by 5%<br>Product after-sales service: We provide timely, high-quality new anode manufacturing and old anode recoating services worldwide.<br>
View MoreTitanium composition:: ASTM B 265GR1<br> Specifications: Width 12.7mm Thickness 0.90mm<br> Standard length: 152 meters/roll<br> Advantage highlights: long life, low energy consumption, low comprehensive use cost, high cost performance
View MoreChlorine precipitation anode life >5 years<br>,cathode life >20 years<br> Generation of effective chlorine concentration: ≥9000 ppm<br> Salt consumption: ≤2.8 kg/ kg·Cl,<br>DC power consumption: ≤3.5 kwh/kg·Cl
View MoreProduct name: Membrane electrolysis for NaCl<br>Product overview: It is a device that uses membrane electrolysis technology to prepare sodium chloride.<br>Product advantages: It has the advantages of high efficiency, environmental protection, energy saving, and a small equipment footprint.<br>Application fields: water treatment, hydrogen and oxygen production, environmental protection, and chemical industry.<br>Product after-sales service: We provide timely, high-quality new anode manufacturing and old anode recoating services worldwide.<br>
View MoreProduct name: Removal of COD Anode<br>Product Overview: OD is an indicator that measures the content of organic matter in water. The higher the value, the more serious the water pollution.<br>Advantages and features: efficient catalysis, good corrosion resistance, good conductivity, environmental protection performance, etc.<br>Scope of application: Titanium anode is suitable for various electrolysis wastewater treatment processes.<br>Such as degrading toxic and harmful wastewater containing phenol, cyanide, chromium, etc.<br>As well as refractory organic wastewater and industrial wastewater.<br>Product after-sales service: We provide timely, high-quality new anode manufacturing and old anode recoating services worldwide.<br>
View MoreProduct Name: Mmo Belt<br>Product Overview: Cathodic protection technology has been widely used in metallurgy, chemical industry, environmental protection and anti-corrosion.<br>Product features: The length of the electrode can be customized according to customer requirements.<br>Advantage highlights: long life, low energy consumption, low comprehensive use cost, and high-cost performance.<br>Applicable scenarios: Suitable for cathodic protection projects in different environments, such as seawater, freshwater, and soil media.<br>The common specifications of MMO belts are as follows:<br>Titanium substrate composition: ASTM B 265GR1<br>Specifications: Width 6.35mm Thickness 0.635mm<br>Standard length: 152 meters/roll<br>
View MoreProduct name: PCB Gold Plating<br>Product Overview: Improve the conductivity, oxidation resistance, and wear resistance of circuit boards to meet their use needs in special occasions.<br>Product features: excellent performance, good electrocatalytic performance, antioxidant capacity, and stability.<br>Highlights: long life, low energy consumption, superior plating uniformity, low comprehensive use cost, and high-cost performance.<br>Applicable scenarios: circuit board gold plating<br>Application conditions: electrolyte acidic/cyanide system, gloss agent & other additives Au: 4-10g/L, CN: low concentration, PH: 4-5; temperature 40℃-60℃;<br>Current density: 0.1-1.0ASD; average 0.2ASD<br>Product after-sales and service: We provide timely and high-quality new anode manufacturing and old anode recoating services globally.<br>
View MoreProduct name: PCB VCP DC Copper Plating<br>Product Overview: Plating materials used in printed circuit board (PCB) manufacturing processes.<br>Product features: stable dimensions, firm coating, corrosion resistance, long service life; <br>effectively reduces tank voltage, a significant energy-saving effect; <br>ultra-low consumption can reduce production costs.<br>Advantages and highlights: long life (can be customized according to customer requirements);<br>low energy consumption, and high electrocatalytic activity.<br>Conditions of use: electrolyte CuSO4·5H20 H2SO4; temperature 20℃-45℃; current density 100-3000A/m2DC;<br>Applicable scenarios: VCP line/horizontal line copper plating, via/fill/pulse copper plating, soft/hard board plating, semiconductor substrate plating;<br>After-sales service: Providing timely and high-quality new anode manufacturing and old anode repainting services worldwide.<br>
View More